| 摘要 |
Dam (11) is attached to the support sheet (2), surrounding the chip at given spacing from it. This forms a reservoir which is subsequently filled with a cast mass (10). An Independent claim is included for the corresponding chip card. Preferred features: The chip is set onto the support sheet in the wafer state. The dam is coated onto the support sheet using an injection unit and dosing needle. Height of application is no less than that of the chip, and it is formed by a dense fluid mass, which hardens. A second injection unit and needle fill the reservoir, using an inviscid mass. The volume is such that underfilling results. The second needle is raised above the chip to complete encapsulation. The casting mass is an adhesive or resin; it may be hardened by UV light. A further sheet is applied to the support sheet with the chip, dam and cast mass. The sheet has a recess for the chip, dam and cast mass. The sheet is welded or stoved to bond it to the support sheet. |
