| 发明名称 |
Pickup apparatus for semiconductor chips |
| 摘要 |
<p>A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed. <IMAGE></p> |
| 申请公布号 |
EP1209724(A2) |
申请公布日期 |
2002.05.29 |
| 申请号 |
EP20010309752 |
申请日期 |
2001.11.20 |
| 申请人 |
SHARP TAKAYA ELECTRONIC INDUSTRY CO., LTD;SHARP KABUSHIKI KAISHA |
发明人 |
YASUMURA, HIROSHI;INTO, TADAYUKI;IWASAKI, NORIKI;GOTO, YASUHIRO;ISHIOKA, TATSUYUKI |
| 分类号 |
H01L21/52;H01L21/301;H01L21/683;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/52 |
| 代理机构 |
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