| 发明名称 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 摘要 |
The disclosure relates to a polishing pad (100) for a chemical mechanical polishing apparatus. The polishing pad has a polishing surface (102) formed with a plurality of circular concentric grooves (104). The polishing surface of the pad may include multiple regions (150,152,154,156) with grooves (144) of different widths and spacings. <IMAGE> <IMAGE> |
| 申请公布号 |
EP1066928(A3) |
申请公布日期 |
2002.05.29 |
| 申请号 |
EP20000305518 |
申请日期 |
2000.06.30 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
OSTERHELD, THOMAS H.;BENNETT, DOYLE EDWARD;REDEKER, FRED C.;ADDIEGO, GINETTO;TOLLES, ROBERT D.;WIJEKOON, KAPILA;TSAI, STAN D.;BONNER, BENJAMIN A. |
| 分类号 |
B24B37/26;B24D13/14;H01L21/304;(IPC1-7):B24D13/14;B24B37/04;B24D13/04 |
主分类号 |
B24B37/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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