RESIN MOLDING APPARATUS FOR SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A resin molding apparatus for a semiconductor chip package is provided to prevent a lead frame from being torn or bent and to prevent a molding defect like a chip-out, by reducing stress applied to the periphery of a guide hole of the lead frame. CONSTITUTION: A molding die(10) includes upper and lower dies(11,12) which have cavities(24,25) for forming an inner space(26) to encapsulate the lead frame(60) by using molding resin wherein a semiconductor chip is mounted on the lead frame. A position determining pin has elasticity for aligning the position of the lead frame, inserted into the guide hole formed in the lead frame of the molding die.