METHOD FOR FORMING METAL BUMP

摘要

PROBLEM TO BE SOLVED: To provide a method for forming multiple metal bumps with high accuracy while suppressing cost increase. SOLUTION: In the method for forming multiple metal bumps, a die of a semiconductor template having holes corresponding to pads is made and used for forming a ceramic template 8. The ceramic template 8 is coated with metal paste 4 and heated, thus forming a metal ball 5 from the metal paste 4. The metal ball 5 is aligned with a pad 7 provided on a substrate 6 and thermocompressed to form a metal bump.