| 摘要 |
PROBLEM TO BE SOLVED: To prevent a chip-type solid capacitor element, especially its corner part from appearing outer sheath resin for the chip-type solid capacitor, even when the chip type solid capacitor element is loaded inclined inside the outer sheath. SOLUTION: In this chip-type solid capacitor 10, which is provided with a chip-type solid capacitor element 11, resin 12 that covers the whole capacitor element, electrodes 13a, 13b, extending out the resin, chip-type solid capacitor element 11 is placed biased to one side from the center of chip-type solid capacitor 10; a convex part 16 is placed extending below the bottom plane 12a of resin 12; and a taper 17 is formed between the upper plane 16a of convex part 16 and the bottom plane 12a of resin 12 in the side to which chip-type solid capacitor element 11 is placed with bias. |
