| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component having such an electrode structure as allowance of positional shift is increased at the time of mounting, and method and structure for mounting a semiconductor device. SOLUTION: A semiconductor device provided, on the electrode 4 thereof, with members 3 and 9 for connecting the semiconductor device 5 with a mounting board 6 comprises a composite connecting member 9 comprising a core 1 and a conductor 2 covering the core where the elastic constant of the core is lower than that of the conductor under normal temperature, and a single layer connecting member 3 comprising a conductor. |
