PSEUDO-WAFER USED FOR MANUFACTURING CHIP-SHAPED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR, AND MANUFACTURING METHOD OF THE CHIP-SHAPED ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To prevent a pseudo-wafer from warping by covering chip components with a resin material. SOLUTION: In the pseudo-wafer, in which a plurality of chip components 10 are formed with their surfaces arranged on the same plane and in which the gaps between the chip components 10 and their bottom sides are covered with the resin material, such that their surfaces are exposed, the resin material is provided with a warpage-preventing member.