| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component packaging apparatus, capable of realizing high speed drive for a mounting head and high positioning accuracy. SOLUTION: In the electronic component packaging apparatus for mounting an electronic component on a substrate by moving a mounting head, the cross section of a uniquely shaped cross-sectional hollow moving beam 14 for composing an X-axis table moved by a Y-axis table and for moving the mounting head in the direction of X axis is shaped into a basic shape of a triangle having one side equaling that of the mounting side of the X-axis direct driving mechanism, to secure a required rigidity with this basic shape. Flat surface, capable of disposing cable bear (R) 11X on the upper part of the cross section is formed, and the apex parts of the polygonal section formed by dividing the cross section are made thick to enable to tool a screw down hole at the thick section for connecting the end of the moving beam 14 to the Y-axis table. This enables attainment of making the moving part of the head driving mechanism light in weight and rigid, to realize high-speed driving and high positioning accuracy.
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