发明名称 HANDLING AND TREATING SYSTEM OF WAFER
摘要 PROBLEM TO BE SOLVED: To prevent contamination and damage on a wafer in a measuring station and measuring stations. SOLUTION: Wafers 22a-n are stored in cassettes 24a-g in input and output transfer to and from the measuring station 12. The cassettes 24a-g have plural trenches having the form and dimension for maintaining the wafers 22a-n substantially in the vertical direction, and the bottoms are opened in order to facilitate vertical transfer of the wafers 22a-n. In the measuring station 12, the wafer 22f is treated while being maintained vertically. By the vertical type wafer treating equipment, contact is performed only with the edge of a wafer, so that air flows intersecting the wafer vertically and contamination caused by fine particles is reduced. Distortion of a wafer which is caused by the influence of gravity in the case of horizontal treatment is reduced by the vertical treatment. By limiting the contact with the edge, contamination and damage can be reduced. By handling the edge, the whole of both surfaces of a wafer is made an effective range of measurement.
申请公布号 JP2002151562(A) 申请公布日期 2002.05.24
申请号 JP20010230899 申请日期 2001.07.31
申请人 ADE CORP 发明人 ROBERT C ABE;PODUJE NOEL S;RANDALL K GOODALL;DOMENICALI PETER
分类号 H01L21/66;H01L21/677;H01L21/68;(IPC1-7):H01L21/66 主分类号 H01L21/66
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