| 摘要 |
PROBLEM TO BE SOLVED: To reduce particles deposited onto a substrate being processed in the micromachining process or film deposition process. SOLUTION: Forward end part of piping for supplying gas into a carrying chamber is coated with a corrosion resistant material. Alternatively, a nozzle made of a corrosion resistant material is fixed to the forward end part of a nozzle in order to prevent corrosion of a material composing the carrying chamber thus suppressing generation of particles. Since contamination is reduced on the substrate, trouble is reduced in the film deposition process and micromachining process. Consequently, the yield of manufacture is increased while reducing the production cost of semiconductor device. |
