| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate, in which adhesion between an electronic component to be embedded and embedding resin therefor is enhanced and the connection between the electronic component and an internal wiring layer or the like is made sure and stable, and to a provide a method of manufacturing the wiring substrate. SOLUTION: This wiring substrate 48 contains an insulation body (insulation layer, core substrate) 1 of the wiring substrate, having front and back surfaces 2, 3, and an electronic component 6 embedded inside a through-hole 4 formed in the body 1 of the wiring substrate via a resin 10, where the surface of the electronic component 6 has been coated in advance with a cover film 8 composed of an organic compound (coupling agent). The method of manufacturing the wiring substrate includes a step of forming the through-hole 4 in the insulating body 1 of the wiring substrate, having front and back surfaces 2, 3; a step of inserting the electronic component 6 into the through hole 4, wherein the surface of the electronic component has been coated in advance with the cover film 8 composed of the organic compound (coupling agent); and a step of embedding the electronic component 6 in the main body 1 of the wiring substrate by filling the resin 10 in the through-hole 4 and solidifying the resin 10. |
