| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable wiring board that can be incorporated into a core substrate via resin, without causing cracks in an electronic component. SOLUTION: The wiring board 1 comprises an insulating core substrate 2, having a front 3 and a rear 4, a through-hole 5 that penetrates between the front 3 and the rear 4 of the core substrate 3, and an electronic component 10 that is incorporated into the through-hole 5 via resin 13. Also, each side surface (inner surface) of at least the through-hole 5 in the core substrate 2 is covered with a coupling agent (organic compound) 6 approximately as thick as 0.1 μm. |
