发明名称 |
INTERCONNECTION FOR DISPLAY ELEMENT, THIN FILM TRANSISTOR SUBSTRATE USING THE SAME AND METHOD OF MANUFACTURING THE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide an interconnection for display element having an improved physical adhesion and a good electrical contact resistance, and also to provide a thin film transistor substrate using the same and a method of manufacturing the substrate. SOLUTION: The interconnection for display element is formed of an Ag alloy with at least one alloy element of a low melting point metal. In a liquid- crystal display panel, by forming gate interconnections 22, 24, and 26 and data interconnections 65, 66, and 68 using such interconnections for display element, it is prevented that corrosion occurs in a process of connecting these interconnections to other conductive material in a contact section and characteristics of the element are degraded. |
申请公布号 |
JP2002151434(A) |
申请公布日期 |
2002.05.24 |
申请号 |
JP20010231153 |
申请日期 |
2001.07.31 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
JEONG CHANG-OH;LEE JAE-GAB;CHO BEOM-SEOK |
分类号 |
G02F1/1343;C22C5/06;C23C14/34;G02F1/1362;G02F1/1368;H01B1/02;H01L21/28;H01L21/3205;H01L21/77;H01L21/84;H01L23/52;H01L23/532;H01L27/12;H01L29/786;(IPC1-7):H01L21/28;G02F1/134;G02F1/136;H01L21/320 |
主分类号 |
G02F1/1343 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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