发明名称 INTERCONNECTION FOR DISPLAY ELEMENT, THIN FILM TRANSISTOR SUBSTRATE USING THE SAME AND METHOD OF MANUFACTURING THE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an interconnection for display element having an improved physical adhesion and a good electrical contact resistance, and also to provide a thin film transistor substrate using the same and a method of manufacturing the substrate. SOLUTION: The interconnection for display element is formed of an Ag alloy with at least one alloy element of a low melting point metal. In a liquid- crystal display panel, by forming gate interconnections 22, 24, and 26 and data interconnections 65, 66, and 68 using such interconnections for display element, it is prevented that corrosion occurs in a process of connecting these interconnections to other conductive material in a contact section and characteristics of the element are degraded.
申请公布号 JP2002151434(A) 申请公布日期 2002.05.24
申请号 JP20010231153 申请日期 2001.07.31
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 JEONG CHANG-OH;LEE JAE-GAB;CHO BEOM-SEOK
分类号 G02F1/1343;C22C5/06;C23C14/34;G02F1/1362;G02F1/1368;H01B1/02;H01L21/28;H01L21/3205;H01L21/77;H01L21/84;H01L23/52;H01L23/532;H01L27/12;H01L29/786;(IPC1-7):H01L21/28;G02F1/134;G02F1/136;H01L21/320 主分类号 G02F1/1343
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