| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board which is superior in interlayer thickness accuracy and suited to laser processing methods. SOLUTION: A resin is impregnated in a base and caused to be dried to semi hardness, thereby making a prepreg. The base is a glass cloth, having a flatted filament section having a minor diameter to major diameter ratio of 0.7 or less and of thickness not greater than 80% of the thickness of the formed prepreg. The prepreg has a minimum melt viscosity of 2,000-100,000 poises at a constant temperature of 130 deg.C and a ration of a logarithmic- converted melt viscosity per minimum at 130 deg.C (log poise/min) of 0.10+0.20. |
