| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board that can improve the productive efficiency of electronic parts and devices and can make electronic component and devices for test and electronic parts and devices for product easily and accurately distinguishable when a ceramic mother substrate is divided into wiring boards. SOLUTION: The mother ceramic substrate 1 is constituted, in such a way that wiring board areas 2 are arranged on the main surface of the substrate 1 in plural number of longitudinal and transversal rows, and, at the same time, metallized wiring layers 4 are formed on the upper and lower surfaces of the regions 2. In addition, placing sections for placing electronic components 5 are provided on at least one of the upper and lower surfaces of the regions 2. The wiring board regions 2 are composed of wiring board regions for test which are used for presetting the mounting and connecting conditions of the electronic parts 5 on the placing sections and to the metallized wiring layers 4. Further, the areas are composed of wiring board areas for mounting on which connecting conductors 3, which connect the metallized wiring layers 4 formed on the upper and lower surfaces of the regions 2 to each other are formed, and the electronic components 5 are mounted on the placing sections and connected to the wiring layers 4, based on their mounting and connecting conditions.
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