发明名称 LAMINATED CHIP COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated chip component which can be adjusted finely for circuit characteristics, such as inductance and the like, and is improved in quality by shifting its inner electrodes, so as to make them suitably overlap with each other, in perspective view. SOLUTION: A plurality of green sheets 11 having an inner electrode and inner electrode connecting via holes are laminated and fixed together through application of pressure for the formation of a laminated chip component, where a conductor circuit is provided. The positions of the via holes 21 are fixed, and conductor patterns 22a, 22b, 23a, and 23b different from each other in core area are laminated.
申请公布号 JP2002151331(A) 申请公布日期 2002.05.24
申请号 JP20000339278 申请日期 2000.11.07
申请人 KOA CORP 发明人 ICHIKAWA MASABUMI;ARIGA YOSHIAKI;YAMABE TAKAYUKI
分类号 H01F41/04;H01F17/00;(IPC1-7):H01F17/00 主分类号 H01F41/04
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