摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated chip component which can be adjusted finely for circuit characteristics, such as inductance and the like, and is improved in quality by shifting its inner electrodes, so as to make them suitably overlap with each other, in perspective view. SOLUTION: A plurality of green sheets 11 having an inner electrode and inner electrode connecting via holes are laminated and fixed together through application of pressure for the formation of a laminated chip component, where a conductor circuit is provided. The positions of the via holes 21 are fixed, and conductor patterns 22a, 22b, 23a, and 23b different from each other in core area are laminated.
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