| 摘要 |
PURPOSE: An automatic bonding method and apparatus is provided to automatically and simultaneously bond a plurality of micro component parts to a single board. CONSTITUTION: A method comprises a first step(S1) of disposing micro component parts and pre-forms at a predetermined position; a second step(S2) of adsorbing each pre-form in sequence; a third step(S3) of disposing the adsorbed pre-forms onto a predetermined board in sequence; a fourth step(S4) of simultaneously holding the micro component parts; a fifth step(S5) of simultaneously disposing the micro component parts onto each pre-form arranged onto the board; a sixth step(S6) of heating and melting simultaneously the pre-forms arranged between the board and the micro component parts; a seventh step(S7) of scrubbing the molten pre-forms by moving the board in vertical and horizontal directions; an eighth step(S8) of cooling the heated pre-forms; and a ninth step(S9) of discharging the board where the micro component parts are mounted.
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