| 摘要 |
PROBLEM TO BE SOLVED: To improve an yield such as worakability of molding or of mounting by removing a warpage and a torsion of a substrate being about 100μm thick and furthermore to improve small-diameter boring (roughness of the inner wall, reproducibility of process, roundness) of a printed wiring board utilizing a laser- beam processing. SOLUTION: This glass cloth is composed of warps and woofs and the count of both warps and woofs is 25 tex-41 tex. Then, a nominal diameter on monofilament of the glass yarn is under E which is regulated by JIS-R3413. The number of the warps T (number/25 mm) is within 44+7. The number of the woofs Y (number/25 mm) is 70% of that of the warps or over and under that of the warps. The condition that the total number of the warps and the woofs for each 25 mm is 73 or over is satisfied. The thickness is 90μm-110μm.
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