| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-density three-dimensional mounting structure. SOLUTION: This three-dimensional mounting structure is formed, in such a way that recessed sections are formed on the surface of a silicon substrate through anisotropic etching or machining, and a semiconductor device and passive components are mounted on the substrate by arranging the device and parts in the recessed sections and forming circuit patterns above the device and components. |
