| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized electronic component which is made thinner than that of a conventional electronic component. SOLUTION: The small-sized electronic component is provided with a base 15 that has lead insertion holes 21 and is made of a conductive material, a crystal chip 19 provided on the base 15, a cover 13 that is coupled with the base 15 to cover the crystal chip 19 and air-tightly applies sealing to the crystal chip 19 in its inside, leads 16 that are inserted through the lead insertion holes 21 and one-side ends of which are connected to the crystal chip 19, an insulation section 17 that is placed to a gap between the leads 16 and the inner circumferential face of the lead insertion holes 21, air-tightly seals the gap and electrically insulates the leads 16 and the base 15, and an insulation film 20 that is placed to the base 15 to electrically insulate the base 15 and a substrate 37 on which the crystal vibrator 14 is mounted. The insulation film 20 is formed by adhering a prescribed insulating material with fluidity to a prescribed bottom face of the base 15. |
