| 摘要 |
PROBLEM TO BE SOLVED: To provide a band-pass filter of small size at a low manufacturing cost. SOLUTION: The band-pass filter is configured with a dielectric block 2 that has through-holes 5, which are formed from one face 4 of the dielectric block 2 to the other opposite face, and with a single-layered dielectric substrate 3 whose rear side 7 is adhered so that it faces the one-face 4 of the dielectric block 2. The faces other that the one-face 4 of the dielectric block 2 are metalized, metalization 9 acting as input/output terminals is applied to the front side 6 of the dielectric substrate 3 and metalization 12 is applied to the rear side 7 of the dielectric substrate 3 at positions opposed to the metalization 9. Thus, the metalization 9 applied to the front side 6 of the dielectric substrate 3 and the metalization 12 applied to the rear side 7 of the dielectric substrate 3 form a capacitor.
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