| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board, with which maintenance of quality is compatible with enhancement of multilayer stacking efficiency. SOLUTION: A plurality of multilayer boards are manufactured, by arranging a plurality of inner circuit boards on a plane, and multilayer stacking is performed using prepregs and metal foils or caplayer base material members, wherein the distance between adjoining inner circuit boards arranged on a plane is adjusted, depending on the characteristics of inner circuit boards and of prepregs. |
