| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of shortening the carrying time of a substrate, improving the processing efficiency of the substrate, and suppressing thermal interference between units as much as possible. SOLUTION: A wafer W is carried among the unit of an applying processing system, the unit of a heating processing system and the unit of a cooling processing system or the like further by sheets by using first and second main carrying bodies 22 and 23. The plural kinds of heating processings are executed to the wafer W by a multifunctional hot plate curing device (MTC).
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