| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of a semiconductor device and to mount a metal plate with satisfactory accuracy by a method wherein the adhesion of the metal plate used to connect a chip electrode to a lead frame to a sealing resin is enhanced, and the outflow of a conductive bonding material used to bond a lead terminal to the metal plate to the outside of the bonding range of the solder plate to the lead terminal is prevented. SOLUTION: The semiconductor device (a plastic package) 3 is formed in such a way that the source electrode 32 of a semiconductor chip 30 and the source terminal 66 of the lead frame 60 are electrically connected with a copper plate 51 so as to be resin-sealed. The surface of the copper plate is roughened and worked, and its adhesion property to a molding resin 8 is enhanced. A step 67 is formed at the source terminal 66 so as to prevent a conductive paste 6 from flowing out. A claw 58 has a structure which is fitted to the lead frame 60. |
