| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a simple structure at a low cost, while incorporating advantages of a reduction in size, rigidity, easy handleability and high reliability, and to provide a method for manufacturing the same. SOLUTION: The semiconductor device comprises an insulating base 1, a thermoplastic resin 2 coating on the base 1, a semiconductor element 3 fixed by the resin 2, a metal wiring 4 passing through the resin 2 and the base 1, a sealing resin 5, and a metal bump 6 connected to a metal spherical part 4b. In this case, one end 4a of the wiring 4 is connected to an electrode 3a of the element 3, and the other end is a metal spherical part 4b, embedded in the base 1 at a side which does not have the element 3 of the base 1. The part 4b is connected to the bump 6. |
