| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board, in which filled through-hole sections and conductor layers formed on the sections are adhered to each other with high adhesive strengths, and to provide a method of manufacturing the wiring board. SOLUTION: The printed wiring board 1 has a substrate 2, through-holes made through the substrate 2, conductor layers 4 formed on the internal surfaces of the through holes, and peripheral edges of the opened ends of the through- holes. The wiring board 1 also has filled through-hole sections 3 formed in the conductor layers 4, first conductive layers 5 which have a 10-point average height RZ of >=5.8μm for surface roughening and are formed on the surfaces of the sections 3, and an interlayer insulating layer 6 covering the surfaces of the substrate 2 and conductive layers 5. In addition, the board 1 also has via holes 7, formed above the conductive layers 5 and second conductive layers 71 formed on the surfaces of the via holes 7. The filled through-hole sections 3 contain an inorganic filler (silica, etc.), having a mean particle diameter of 3-12μm, a thermosetting resin (an epoxy resin, etc.), and curing agent for the resin. |
