| 摘要 |
PURPOSE: A subminiature probe structure is provided to be capable of distributing a stress caused from a probe structure when probing an electronic product, by compositely forming curved, horizontal and vertical portions from one end to the other end of the probe structure. CONSTITUTION: A center body portion(302) is placed between a buffer portion(310) connected to a base end(301) and a buffer part(311) connected to a contact end(303). When connected with an electric terminal of an electronic part, a stress transferred from the contact end(303) via the buffer portion(311) is transferred to the base end(301) via the buffer portion(310), so that the stress is distributed effectively. A curved structure of a probe structure(300) prevents a damage of the electronic part. There is a stepped corn(D1) between the base end(301) and the contact end(303) in a z-axis direction.
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