发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting system, capable of dealing with a plurality of types of electronic components having different mounting load. SOLUTION: In the system for mounting an electronic component on a substrate, a nozzle block 32 for detachably mounting and holding a suction nozzle 36 for sucking an electronic component on a nozzle holder 35 is supported freely liftably by a spline shaft 31 on a mounting head for picking up and holding to mount it. When the component is compressed on the substrate to be mounted, air pressure, supplied from a positive pressure supply source 25 to a bellofram 26 abutting against the upper end of a spline shaft 31 to act downward load, is controlled by a control section 40 according to component types. Thereby, a plurality of types of electronic components which have different mounting loads can be mounted, without requiring step replacing works.
申请公布号 JP2002151891(A) 申请公布日期 2002.05.24
申请号 JP20000347813 申请日期 2000.11.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAGAO KAZUHIDE;TANAKA YUJI;KASHIWAGI YASUHIRO
分类号 B25J15/00;B25J15/06;H05K13/04 主分类号 B25J15/00
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