摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting system, capable of dealing with a plurality of types of electronic components having different mounting load. SOLUTION: In the system for mounting an electronic component on a substrate, a nozzle block 32 for detachably mounting and holding a suction nozzle 36 for sucking an electronic component on a nozzle holder 35 is supported freely liftably by a spline shaft 31 on a mounting head for picking up and holding to mount it. When the component is compressed on the substrate to be mounted, air pressure, supplied from a positive pressure supply source 25 to a bellofram 26 abutting against the upper end of a spline shaft 31 to act downward load, is controlled by a control section 40 according to component types. Thereby, a plurality of types of electronic components which have different mounting loads can be mounted, without requiring step replacing works. |