| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the production efficiency by reducing the number of manufacturing steps and applying non-contact exposure during photoetching, while preventing warping of a substrate, in a metal foil resistor with a metal foil being adhered to the substrate and is packaged airtight with an exterior package material. SOLUTION: A substrate is made of crystallized glass having a large thermal expansion coefficient, and the metal foil is made of Ni-Cr alloy, and the thermal expansion coefficients of the substrate and metal foil are approximated to each other. The crystallized glass contains SiO2, Li2O, Al2O3, K2O, ZnO, P2O5, ZrO2, and Sb2O3 and has thermal expansion coefficient of 10-13 ppm/ deg.C.</p> |
