| 摘要 |
PROBLEM TO BE SOLVED: To provide a trace sample working observation apparatus and a minute sample working observation method where cross-sectional observation and analysis of wafer cross section from horizontal direction up to vertical direction can be performed with high resolution, high precision and high throughput, without having to breaking the wafer which is to become samples. SOLUTION: This apparatus is equipped with a focused ion beam optical system and electron optical system in the same evacuation device and a manipulator, to separate a trace sample, including a desired region of the sample by a charged particle beam molding work and to pick up the separated trace sample, and a manipulator control device for driving the manipulator, independently of a wafer sample board.
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