METHOD FOR WIRING PLATED LEAD-OUT WIRE

摘要

PROBLEM TO BE SOLVED: To provide a method for wiring a plated lead-out wire which can easily and automatically wire plated lead-out wires led out from respective terminals having a wiring pattern and formed toward a bus line. SOLUTION: This method includes: a step where a terminal area 15 is specified at a position corresponding to the bus line and dummy terminals 16 corresponding to respective via hole parts 12 are virtually arranged in the terminal area 15; a step where plated lead-out wires 17 are formed connecting the via hole parts 12 and dummy terminals 16 corresponding to them in the shortest distances; and a step where the terminal area 15 is moved in parallel to the external shape of a semiconductor package so that the plated lead-out wires 17 cross the external shape of the semiconductor packages not at right angles.