发明名称 HEAT SINK
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat sink having a small size, which is does not have attitude dependence, and high heat transportation capability. SOLUTION: The heat sink comprises a heat receiving plate 3, a plate-type heat pipe 5 thermally connected to the plate 3, and a radiating fin row 7 connected thermally to the pipe 5. The pipe 5 has a two-layer superposing structure, in which the one plate-type heat pipe is folded substantially at a center in the length direction of pore. A heating medium evaporated in the pipe of a lower side adhered with the plate 3 flows in the pipe of an upper side. Thus, a large quantity of heat is transferred to the pipe of the upper side, to improve the heat transportation capability.</p>
申请公布号 JP2002151636(A) 申请公布日期 2002.05.24
申请号 JP20000342867 申请日期 2000.11.10
申请人 TS HEATRONICS CO LTD 发明人 KANEKO TATSUYA;SATO DAISUKE
分类号 F28D15/02;H01L23/427;H05K7/20;(IPC1-7):H01L23/427 主分类号 F28D15/02
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