| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly productive device for cleaving a semiconductor element, which can obtain a stable cleaving force and perform cleavage efficiently. SOLUTION: This device 20 for cleaving a semiconductor element has an elastic member 13a that has a smooth surface and moves horizontally, and a roller 6 that moves vertically and can rotate. A work 2 that has a cut formed beforehand at a position to be cleaved is placed on the elastic member 13a, and the roller 6 is pressed on the work 2 while the elastic member 13a is moved to cleave the work 2 and obtain a chip 2A. The cleaving device 20 has a stage 11 which is provided with an eccentric cam 14 and holds the roller 6 rotatably and is moved vertically by rotation of the eccentric cam 14, a stopper which is disposed on the stage 11 and defines the lower end position of the roller 6 adjustably, a displacement sensor 9 which is disposed on the stage to detect the lower end position, and a moving means 8 for moving the elastic member 13a horizontally. |
