发明名称 CIRCUIT BOARD FOR HIGH-FREQUENCY WAVES
摘要 PROBLEM TO BE SOLVED: To solve a problem that conventional circuit board a high-frequency wave of 10 GHz or higher cannot be transmitted due to deterioration of transmission characteristics of a high-frequency signal, by abruptly changing an impedance at a connecting pad by generating a stray capacitance between the pad and a round layer of the board. SOLUTION: The circuit board 1 for the high-frequency wave comprises the connecting pad 3 electrically connected to a high-frequency semiconductor element 2 on the lower surface of an insulating board 1a, having a relative permittivity (ε) to input/output a high-frequency signal having a frequency F (GHz) to/from an external electric circuit 4. In this board 1, an area S (mm2) of the pad 3 satisfies the equation 2<=S×1,000<=404.4-4.2F-16.7ε. Thus, a high stray capacitance which would adversely influences the input/output the high-frequency signal are not generated between the pad and the ground layer of the board 1, and signals of 10 to 80 GHz can be transmitted with proper transmission characteristics.
申请公布号 JP2002151621(A) 申请公布日期 2002.05.24
申请号 JP20000344479 申请日期 2000.11.10
申请人 KYOCERA CORP 发明人 MATSUZONO SEIGO;BASHO YOSHIHIRO
分类号 H05K3/34;H01L23/12;H01P5/02;(IPC1-7):H01L23/12 主分类号 H05K3/34
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