| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of uniform plating being difficult to form in a small-diameter bore in manufacturing a TBGA, using a blind via hole and embedding a blind hole with resin or the like. SOLUTION: A blind hole has been previously embedded by a method for plating using a liquid in the hold, that is, the hole is plated, so that the blind hole is embedded by a copper foil 2 before giving conductivity to a hole wall, as shown by reference numeral 5 in Figure. Thus, difficulties with high aspect ratio such as in around plating, embedding with resin or the like is facilitated by lowering the aspect ratio. The copper thickness for forming a pattern can be made small, the recess of the blind via hole becomes uniform, and a liquid photoresist suitable for etching a high-density fine wiring becomes usable. Power can be supplied simply, due to the continuity (endless) of the feature of the tape, and plating loss (parts which are not used as the pattern used to supply the power) is eliminated.
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