SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a small-sized and light-weight semiconductor device of high function which mounts semiconductor elements and includes chip components such as resistors, capacitors and inductors. SOLUTION: In this semiconductor device, circuit boards on which semiconductor elements are mounted are laminated in plural layers, and the circuit boards are mutually and electrically connected. Chip components are accommodated in a cavity which is formed penetrating at least two layers of the circuit boards, and electrically connected with the circuit boards.