| 摘要 |
PURPOSE: A package for a CMOS image sensor and a fabricating method therefor are provided to perform lamination and miniaturization, decrease moisture absorption, and increase heat release by using a base member as a metal plate. CONSTITUTION: A penetrating hole(5) is formed in a base member(10), and an adhesive layer(6) is formed at one side(10a) of the base member(10). A circuit pattern(20) adheres to the base member(10), and a bonding pad(21) and a ball pad(22) are formed at both sides of the circuit pattern(20). An insulating layer(30) is formed at one side(10a) of the base member(10) in which the circuit pattern(20) is formed so that the bonding pad(21) and the ball pad(22) are exposed. A chip(40) is fixed in the base member(10), and ports of the chip(40) are connected to the bonding pad(21) by the bonding flip chip(50), respectively. An encapsulant(60) is charged between the insulating layer(30), the bonding flip chip(50), and a circumference portion of the chip(40). A cover glass(70) is fixed in the other side(10b) of the base member(10) for sealing up the penetrating hole(5) of the base member(10).
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