METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

A method for manufacturing a circuit board comprises a pressing step wherein a substrate member (3) or a substrate member with a metal-foil circuit and a metal foil (7) or a resin-coated metal foil disposed over both faces or one face is sandwiched by metal plates (1) and the stack is at least either heated or pressed. This circuit board is provided with a hard layer (2) over one face or both faces of each metal plate, so that the metal layer is protected by the hard layer. Further, finishing the surface of the hard layer to a smooth one makes it possible to easily remove resin or contaminants deposited on the metal plates and results in prolongation of the lifetime of the metal plate.