Quad flat non-leaded package structure for housing CMOS sensor

摘要

A quad flat non-leaded package structure for housing a sensor. The package includes a die pad, a plurality of leads, a die, a plurality of bonding wires, a packaging plastic body and a lid cover. A plurality of supporters are formed near the edges on the backside of the die pad. The plurality of leads is positioned at a well-defined distance away from the four sides of the die pad. The packaging plastic body is formed on the upper surface near the peripheral section of the leads. The space between the die pad and the leads is filled by the packaging plastic material but the bottom section of the leads and the bottom section of the supporters on the backside of the die pad are exposed. The die is attached to the upper surface of the die pad and is electrically connected to the leads using the bonding wires. The lid cover is placed over the packaging plastic body.