CONSTITUENT SUBSTRATE FOR ELECTRONIC EQUIPMENT USING WIRING LAYER MADE OF COPPER AND TRANSPARENT CONDUCTIVE LAYER MADE OF COMPOSITE OXIDE CONTAINING INDIUM OXIDE AND METAL OXIDE AS MAIN COMPONENTS AND ELECTRONIC EQUIPMENT USING THE SAME

摘要

The present invention provides a constituent substrate for electronic equipment using a wiring layer made of a material which causes no increase in electric resistance value in a contact portion even in direct contact with a transparent conductive layer made of ITO or the like. The constituent substrate for electronic equipment of the present invention uses a wiring layer made of copper, and a transparent conductive layer made of a composite oxide containing indium oxide and an oxide of at least one metal selected from the group consisting of zinc, tin, gallium, thallium, magnesium, and lead as main components.