APPARATUS FOR PREVENTING UNNECESSARY LAYER FROM BEING DEPOSITED ON INNER WALL OF SPUTTERING APPARATUS

摘要

PURPOSE: An apparatus for preventing an unnecessary layer from being deposited on the inner wall of a sputtering apparatus is provided to prevent cross contamination and to control plasma discharge in an unnecessary region of the apparatus, by installing a simple apparatus in a multi-target sputter having a batch-type chamber. CONSTITUTION: A vacuum chamber generates plasma discharge. One or more targets(200) is mounted on a surface of the vacuum chamber, composed of a predetermined material to deposit. A target supporting unit(300) supplies power for maintaining the plasma discharge, supporting the target and connecting the target to the vacuum chamber. The target material is deposited as a thin film type on one or more wafers(400) installed on a surface facing the target. An intercepting unit(500) intercepts plasma discharge particles facing outside and sputtered particles, surrounding the respective targets and a space between the respective wafers. A driving unit(600) mechanically drives the intercepting unit and transfers the intercepting unit to a direction opposite to the wafer, connected to the intercepting unit.