| 发明名称 |
POSITIVE TYPE PHOTOSENSITIVE EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer. |
| 申请公布号 |
WO0241079(A2) |
申请公布日期 |
2002.05.23 |
| 申请号 |
WO2001EP12819 |
申请日期 |
2001.11.06 |
| 申请人 |
VANTICO AG;VANTICO K.K.;SUGANO, YASUAKI;NOJIMA, YASUHARU |
发明人 |
SUGANO, YASUAKI;NOJIMA, YASUHARU |
| 分类号 |
G03F7/004;C08G59/62;G03F7/032;G03F7/038;G03F7/039;H05K1/03;H05K3/28;H05K3/46 |
主分类号 |
G03F7/004 |
| 代理机构 |
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代理人 |
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