| 摘要 |
PURPOSE: Equipment for fabricating a semiconductor is provided to control generation of particles, by preventing a gas condensation phenomenon generated by a rapid variation of pressure and temperature in a sub chamber while the sub chamber becomes vacuum by a vacuum pump. CONSTITUTION: An electrostatic chuck(20) to which a wafer is loaded is installed in a process chamber(10). A cryo pump(30) decreases the inside pressure of the process chamber, installed at one side of the process chamber and connected to the inside of the process chamber. A turbo pump(40) absorbs and exhausts particles generated in cleaning the electrostatic chuck, installed at the other side of the process chamber and connected to the inside of the process chamber.
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