| 摘要 |
PURPOSE: A method for depositing vapor phase organic matter is provided which uniformly deposits the vapor phase organic matter on a substrate having a large area, grows an organic thin film at a high rate, and finely adjusts a mixing amount of the organic matter, and an apparatus for depositing the vapor phase organic matter using the method is provided. CONSTITUTION: The apparatus for depositing vapor phase organic matter comprises a vacuum chamber comprising an inner space separated from the outside, a matrix resting part(140) which is equipped on the bottom surface of the inner space so as to rest a matrix(10) on which the vapor phase organic matter is deposited, an ejection part(110) which is positioned at the upper part of the matrix resting part(140) so as to eject the vapor phase organic matter toward the matrix resting part(140), and one or more of thermal insulation heaters(130) emitting heat into the inside of upper wall surface and side wall surfaces; one or more organic matter chambers(200) comprising a crucible(220) consisting of one or more carrier gas inlet holes into which a carrier gas carrying the vapor phase organic matter is flown, one or more vapor phase organic matter outlet holes through which the vapor phase organic matter and the carrier gas are flown out and an inner space which is made of a heat resisting material and stores the organic matter, and an organic matter heating heater which envelops the outer part of the crucible(220), and heats the inside of the crucible to a temperature at which the organic matter is evaporated; a flow control part which is connected to the carrier gas inlet holes to control amount and flow rate of the carrier gas flown into the organic matter chambers(200); a vapor phase organic matter transfer pipe(210) which is formed so that the organic matter transfer pipe(210) penetrates the deposition chamber(100) and the organic matter chambers(200), and the vapor phase organic matter in the organic matter chambers(200) is transferred to the ejection part(110); and a vacuum pump(150) lowering an inner pressure of the deposition chamber(100).
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