发明名称 Controlled application process for fluid materials involves measuring size or throughput as basis for modifying temperature or pressure of materials
摘要 The controlled application process involves measuring the size of the area to which the fluid is applied or the throughput of the fluid as a basis for modifying the temperature or pressure of the fluid within set tolerances. The state of the application nozzle is monitored so that an alarm sounds if the nozzle is not in satisfactory condition.
申请公布号 DE10055723(A1) 申请公布日期 2002.05.23
申请号 DE2000155723 申请日期 2000.11.10
申请人 HENKEL KGAA 发明人 KLING, HANS-WILLI;HAENISCH, MATTHIAS;BARTIK-HIMMLER, IBOLYA;MOLL, REINER;KREY, WOLFGANG;OPITZ, WERNER
分类号 B05B12/00;B05B12/08 主分类号 B05B12/00
代理机构 代理人
主权项
地址