Controlled application process for fluid materials involves measuring size or throughput as basis for modifying temperature or pressure of materials
摘要
The controlled application process involves measuring the size of the area to which the fluid is applied or the throughput of the fluid as a basis for modifying the temperature or pressure of the fluid within set tolerances. The state of the application nozzle is monitored so that an alarm sounds if the nozzle is not in satisfactory condition.
申请公布号
DE10055723(A1)
申请公布日期
2002.05.23
申请号
DE2000155723
申请日期
2000.11.10
申请人
HENKEL KGAA
发明人
KLING, HANS-WILLI;HAENISCH, MATTHIAS;BARTIK-HIMMLER, IBOLYA;MOLL, REINER;KREY, WOLFGANG;OPITZ, WERNER