发明名称 |
Verfahren zum Mikro-Bearbeiten eines in der Oberfläche eines Siliziumkörpers integrierten Sensors |
摘要 |
A method for micro-machining the surface of a silicon substrate (10,14) which encompasses a minimal number of processing steps. The method involves a preferential etching process in which a chlorine plasma-etching is capable of laterally etching an N+ buried layer (12) beneath the surface of the bulk substrate (10,14). Such a method is particularly suitable for forming sensing devices which include a small micro-machined element (18), such as a bridge, cantilevered beam, membrane, suspended mass or capacitive element, which is supported over a cavity (22) formed in a bulk silicon substrate (10,14). The method also permits the formation of such sensing devices on the same substrate as their controlling integrated circuits. The method can optimise the dimensional characteristics of the micro-machined element (18) or encapsulate the micro-machined element (18). <IMAGE> <IMAGE> |
申请公布号 |
DE69429381(T2) |
申请公布日期 |
2002.05.23 |
申请号 |
DE1994629381T |
申请日期 |
1994.04.18 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
SPARKS, DOUGLAS RAY;HEALTON, ROBERT LAWRENCE;BROWN, RONALD EUGENE;CHRISTENSON, JOHN CARL |
分类号 |
H01L21/302;G01L9/00;G01P15/08;H01L21/3065;H01L21/764;H01L29/84 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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