发明名称 METHOD FOR APPLYING POWER OF PLASMA POLYMERIZATION CONTINUOUS PROCESSING APPARATUS
摘要 PURPOSE: A method for applying a power of a plasma polymerization continuous processing apparatus is provided, which improves a quality of a polymer film polymerized on a surface of a base film. CONSTITUTION: A power supply voltage(40) is applied to an idle roller(51) and a facing electrode(22). The idle roller is located beside an unwinder roll(11) of a transport chamber(36) and contacts with a transported base film and endows a tensile force to prevent the base film from being drooped. An axis of both ends of the idle roller is supported by an axis supporting part. The base film is polymerized in a polymerization chamber(20) while being transported from an unwinder chamber(36) to a winder chamber(38), and a pressure in the chamber is controlled by a vacuum pump. And an electrode(22) facing the base film generates a voltage difference in the base film. A reaction gas is injected through an injection hole and a plasma discharge is occurred by an electricity applied to the electrode. During the plasma discharge, a molecular bonding of the reaction gas is disconnected, and a polymer is formed on a surface of the base film located between the electrodes.
申请公布号 KR20020037997(A) 申请公布日期 2002.05.23
申请号 KR20000068033 申请日期 2000.11.16
申请人 LG ELECTRONICS INC. 发明人 AHN, SEUNG PYO;HA, SAM CHEOL
分类号 H05H1/36;(IPC1-7):H05H1/36 主分类号 H05H1/36
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