POLYMER FILM DEPOSITION METHOD FOR HEAT EXCHANGER PIN

摘要

PURPOSE: A method for increasing the deposition density of polymer film on heat insulation pin for heat exchanger by supplying two or more kinds of non-reactive gases for increasing ionization ratio into processing chamber, together with reactive gas is provided to improve hydrophilicity, which is a paramount factor affecting to heat exchange efficiency. CONSTITUTION: In a polymer film deposition method for increasing hydrophilicity of heat exchanger pin, the method is characterized in that the amount of non-reactive gases supplied into processing chamber satisfies the follow relations: S1+S2+S3=100; S1=S2; 0.3S2<=S2<=0.7S2 where S1 is an amount of C2H2 supplied, S2 is an amount of N2 supplied, and S3 is an amount of He or Ne supplied.