发明名称 |
Package of an image sensor device |
摘要 |
The present invention provides a package comprising a lead frame, which has a die pad and a plurality of leads located at the peripheral of the die pad. An image sensor chip has an active surface and a corresponding back surface. A plurality of bonding pads are on the active surface. A plurality of leads are electrically connected from the bonding pads to the inner leads. The image sensor chip, the die pads and the inner leads are encapsulated with a transparent molding material. A cavity is formed on a surface of the transparent molding material corresponding to the active surface. The area of the cavity, which is large enough just to cover the chip of the image sensor, has a smooth surface after a polishing process.
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申请公布号 |
US2002060358(A1) |
申请公布日期 |
2002.05.23 |
申请号 |
US20010841855 |
申请日期 |
2001.04.25 |
申请人 |
HUNG CHIN-YUAN;CHIANG LIEN-CHEN;HSIAO CHENG-SHIU |
发明人 |
HUNG CHIN-YUAN;CHIANG LIEN-CHEN;HSIAO CHENG-SHIU |
分类号 |
H01L23/31;H01L25/10;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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